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US Patent Issued to Databricks on Jan. 20 for "Notebook snapshot restore in a serverless setting" (Washington Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,267, issued on Jan. 20, was assigned to Databricks Inc. (San Francisco). "Notebook snapshot restore in a serverless setting" was invented b... Read More


US Patent Issued to QUALCOMM on Jan. 20 for "Uplink synchronization refinement for inter-cell mobility" (California Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,280, issued on Jan. 20, was assigned to QUALCOMM Inc. (San Diego). "Uplink synchronization refinement for inter-cell mobility" was invented... Read More


US Patent Issued to Shenzhen Pharmacin on Jan. 20 for "Pharmaceutical compositions" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,793, issued on Jan. 20, was assigned to Shenzhen Pharmacin Co. Ltd. (Shenzhen, China). "Pharmaceutical compositions" was invented by Zeren ... Read More


US Patent Issued to TOYOTA JIDOSHA on Jan. 20 for "Vehicle display device, vehicle display method, and non-transitory storage medium" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,352, issued on Jan. 20, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Vehicle display device, vehicle display method, and non-trans... Read More


US Patent Issued to Tokyo Electron on Jan. 20 for "Substrate processing apparatus and cleaning method" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,219, issued on Jan. 20, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and cleaning method" was invented by M... Read More


US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Jan. 20 for "Packaging module including electromagnetic shielding structure having conductive pillars and conductive adhesive, and packaging method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,744, issued on Jan. 20, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Packaging module including electromagnetic shield... Read More


US Patent Issued to Infineon Technologies Austria on Jan. 20 for "Asymmetric half bridge flyback converter" (German Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,488, issued on Jan. 20, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Asymmetric half bridge flyback converter" was... Read More


US Patent Issued to Osaka Gas on Jan. 20 for "Electrolysis cell unit, electrolysis cell device, hydrocarbon production system, and production method and use method of electrolysis cell unit" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,151, issued on Jan. 20, was assigned to Osaka Gas Co. Ltd. (Osaka, Japan). "Electrolysis cell unit, electrolysis cell device, hydrocarbon p... Read More


US Patent Issued to TUNEGO on Jan. 20 for "Tokenized media content management" (California, Nevada Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,437, issued on Jan. 20, was assigned to TUNEGO INC. (Henderson, Nev.). "Tokenized media content management" was invented by Mark Goldston (... Read More


US Patent Issued to AGCO on Jan. 20 for "Corn head row units, deck plates for corn head row units, and harvesting headers having such row units" (Kansas Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,256, issued on Jan. 20, was assigned to AGCO Corp. (Duluth, Ga.). "Corn head row units, deck plates for corn head row units, and harvesting... Read More