ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,641, issued on Aug. 19, was assigned to Nxera Pharma UK Limitied (Great Britain). "Prostaglandin EP 4 receptor antagonist compounds" was in... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,950, issued on Aug. 19, was assigned to The Regents of the University of California (Oakland, Calif.). "Fusion constructs as protein over-e... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,209, issued on Aug. 19, was assigned to MKS Inc. (Andover, Mass.). "Methods and apparatus for reporting inlet pressure in mass flow control... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,805, issued on Aug. 19, was assigned to Harman International Industries Inc. (Stamford, Conn.). "Method and system for instrument separatin... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,855, issued on Aug. 19, was assigned to Hilti AG (Schaan, Liechtenstein). "Method for producing a green body and method for further process... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,630, issued on Aug. 19, was assigned to MOTOROLA SOLUTIONS INC. (Chicago). "System and method for reducing resources used for uploading a v... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,361, issued on Aug. 19, was assigned to EMBR Labs IP LLC (Boston). "Methods and apparatuses for manipulating temperature" was invented by M... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,116, issued on Aug. 19. "Labor saving solar roofing shingle" was invented by Colin Felton (Coos Bay, Ore.). According to the abstract* rel... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,991, issued on Aug. 19, was assigned to Ohmium International Inc. (Newark, Calif.). "Systems and circuits for connecting components of a hy... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,772, issued on Aug. 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Molded dies in semiconductor packag... Read More