Guwahati, Feb. 16 -- Union Minister of State for Electronics and Information Technology, Rajeev Chandrasekhar, announced that Assam is poised to get a Rs 25,000 crore semiconductor packaging plant, on Thursday.
During the inauguration of the Digital India Future Skills Summit at Gauhati University, Chandrasekhar highlighted Assam's pivotal role in emerging technological advancements, attributing the development to the leadership of Chief Minister Himanta Biswa Sarma.
Underlining the significance of preparing the youth for the burgeoning sectors of electronics, semiconductors, cybersecurity, and AI, Chandrasekhar emphasised Prime Minister Modi's leadership in fostering growth opportunities in these domains.
The summit, organised under ...