Japan, Jan. 28 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows:
Application Number: JP,2022-118836
Category (FI): B23K26/351,B23K26/53,H01L21/78@B,H10P58/00@B
Stage: Grant (IP right document published.)
Filing Date: July 26, 2022
Publication Date: Feb. 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....