Japan, Oct. 30 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows:

Application Number: JP,2021-147893

Category (FI): H01L21/68@N,H01L21/304,631,H01L21/304,622@Y,H01L21/304,601@Z,B23K26/53,H01L21/78@L,H01L21/78@M,H01L21/78@Q

Stage: Grant (IP right document published.)

Filing Date: Sept. 10, 2021

Publication Date: March 23, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....