Japan, Oct. 30 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows:
Application Number: JP,2021-132371
Category (FI): H01L21/304,611@Z,B23K26/00@B,B23K26/361,B23K26/53,H01L21/304,601@B
Stage: Grant (IP right document published.)
Filing Date: Aug. 16, 2021
Publication Date: March 1, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....