Japan, Nov. 7 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD AND REMOVAL DEVICE.' Other related details are as follows:
Application Number: JP,2023-011274
Category (FI): H01L21/78@L,H01L21/68@N,H01L21/304,601@Z
Stage: Grant (IP right document published.)
Filing Date: Jan. 27, 2023
Publication Date: March 16, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....