Japan Intellectual Property Rights: WAFER DETERMINATION METHOD, DETERMINATION PROGRAM, DETERMINATION DEVICE, WAFER MANUFACTURING METHOD AND WAFER

Japan, Nov. 7 -- SUMCO CORP has got intellectual property rights for 'WAFER DETERMINATION METHOD, DETERMINATION PROGRAM, DETERMINATION DEVICE, WAFER MANUFACTURING METHOD AND WAFER.' Other related details are as follows:

Application Number: JP,2022-096858

Category (FI): H01L21/66@J,G06T7/00,350@B,H01L21/66@N,G01N21/956@A

Stage: Grant (IP right document published.)

Filing Date: June 15, 2022

Publication Date: Dec. 27, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....