Japan, Feb. 12 -- SEIKO EPSON CORP has got intellectual property rights for 'THICKNESS CALCULATION METHOD, THICKNESS CALCULATION PROGRAM, RECORDING MEDIUM, AND THICKNESS CALCULATION DEVICE.' Other related details are as follows:
Application Number: JP,2022-006587
Category (FI): G01B17/02@Z,A61B5/107,A61B8/00
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 19, 2022
Publication Date: July 31, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....