Japan, Nov. 7 -- SHENGYI TECHNOLOGY CO LTD has got intellectual property rights for 'THERMOSETTING RESIN COMPOSITION AND INSULATING ADHESIVE FILM THEREOF.' Other related details are as follows:
Application Number: JP,2023-204812
Category (FI): C09J7/30,C09J11/04,C09J163/02,C09J11/08,C09J11/06,C09J163/00,C08L79/00,C08K3/013,C08K9/00,C08L63/00@C,C08K9/06
Stage: Grant (IP right document published.)
Filing Date: Dec. 4, 2023
Publication Date: July 11, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....