Japan, Oct. 30 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'THERMOSETTING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:
Application Number: JP,2021-148089
Category (FI): C08L101/00,C08K3/013,C08K3/36,H01L23/30@R
Stage: Grant (IP right document published.)
Filing Date: Sept. 10, 2021
Publication Date: March 23, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....