Japan, Oct. 30 -- YAZAKI CORP has got intellectual property rights for 'THERMISTOR ASSEMBLY BODY, TEMPERATURE SENSOR, AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2023-105621
Category (FI): H01C7/02,G01K7/22@J,H01C17/02,H01C7/04
Stage: Grant (IP right document published.)
Filing Date: June 28, 2023
Publication Date: Jan. 17
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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