Japan Intellectual Property Rights: SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM

Japan, Jan. 28 -- KOKUSAI ELECTRIC CORP has got intellectual property rights for 'SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM.' Other related details are as follows:

Application Number: JP,2023-027702

Category (FI): H10P14/694@B,H01L21/316@X,H01L21/318@B,H01L21/31@B,H10P14/60,101@B,H10P14/692@X

Stage: Grant (IP right document published.)

Filing Date: Feb. 24, 2023

Publication Date: Sept. 5, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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