Japan, Nov. 7 -- ABSOLICS INC has got intellectual property rights for 'SUBSTRATE FOR SEMICONDUCTOR PACKAGING, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR PACKAGING.' Other related details are as follows:
Application Number: JP,2023-201340
Category (FI): H01L23/14@C,H01L23/12@F,H05K7/20@D,H05K7/20@C,H01L23/36@C,H01L23/12@J
Stage: Grant (IP right document published.)
Filing Date: Nov. 29, 2023
Publication Date: June 13, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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