Japan, Jan. 28 -- DAIYA SEIKI CO LTD has got intellectual property rights for 'SPINDLE UNIT AND PROCESSING DEVICE COMPRISING THE SAME.' Other related details are as follows:

Application Number: JP,2022-044408

Category (FI): B23Q17/09@H,B23B47/24,B23Q17/09@A

Stage: Grant (IP right document published.)

Filing Date: March 18, 2022

Publication Date: Sept. 29, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....