Japan, Feb. 12 -- INTEL CORP has got intellectual property rights for 'SKIP LEVEL VIA IN METALIZATION LAYER FOR INTEGRATED CIRCUIT DEVICE.' Other related details are as follows:
Application Number: JP,2024-137946
Category (FI): H10W20/49@T,H01L23/12@E,H01L21/88@T,H01L21/88@Z,H01L27/04@D,H01L21/82@L,H10D89/00,101@D,H10D89/10@L,H10W70/00@E,H10W20/43,H10W20/44@X
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 19, 2024
Publication Date: Nov. 6, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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