Japan, Oct. 30 -- RISU PACK CO LTD has got intellectual property rights for 'RESIN SHEET FOR THERMOFORMING AND MOLDED ARTICLE.' Other related details are as follows:
Application Number: JP,2021-151992
Category (FI): C08L23/10,C08L23/12,B32B27/32@E,C08K3/26,C08L23/04,C08L23/06,C08K3/013,C08J5/18
Stage: Grant (IP right document published.)
Filing Date: Sept. 17, 2021
Publication Date: March 30, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....