Japan, Jan. 28 -- MITSUBISHI ENGINEERING PLASTICS CORP has got intellectual property rights for 'RESIN COMPOSITION, PELLET, MOLDING, ELECTROMAGNETIC WAVE ABSORBER, AND METHOD FOR PRODUCING RESIN COMPOSITION.' Other related details are as follows:
Application Number: JP,2021-204659
Category (FI): C08L67/00,C08L77/00,H05K9/00@W,C08K3/04,C08J3/22,C08L67/02,H05K9/00@M
Stage: Grant (IP right document published.)
Filing Date: Dec. 16, 2021
Publication Date: June 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....