Japan, Nov. 7 -- MCPP INNOVATION LLC has got intellectual property rights for 'RESIN COMPOSITION, CROSSLINKED RESIN COMPOSITION, MOLDED BODY, ELECTRIC WIRE COAT MATERIAL, AND ELECTRIC WIRE.' Other related details are as follows:
Application Number: JP,2021-003569
Category (FI): C08L51/06,C08K3/34,H01B7/295,C08K3/22
Stage: Grant (IP right document published.)
Filing Date: Jan. 13, 2021
Publication Date: July 26, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....