Japan, Feb. 12 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RELEASE FILM FOR SEMICONDUCTOR MOLDING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-034606
Category (FI): B29C33/68,H10W74/01@T,B29C45/14,H01L21/56@T,B32B27/30@A,B29C45/26,B29C33/12
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 7, 2022
Publication Date: Sept. 20, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....