Japan, Jan. 23 -- LAM RESEARCH CORPORATION has got intellectual property rights for 'REDUCED DIAMETER CARRIER RING HARDWARE FOR SUBSTRATE PROCESSING SYSTEM.' Other related details are as follows:
Application Number: JP,2024-228084
Category (FI): H10P72/72,H10P50/20,101@G,H10P14/60,101@C,C23C16/44@B,H01L21/302,101@G,H01L21/31@C,H01L21/68@R
Stage: Grant (IP right document published.)
Filing Date: Dec. 25, 2024
Publication Date: April 10, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....