Japan, Feb. 6 -- SHINKAWA LTD has got intellectual property rights for 'PUSH-UP DEVICE OF SEMICONDUCTOR DIE.' Other related details are as follows:
Application Number: JP,2023-072917
Category (FI): H01L21/68@E,H10P72/00@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 27, 2023
Publication Date: Nov. 8, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....