Japan, Feb. 18 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'PROCESSING METHOD FOR BONDED WAFER.' Other related details are as follows:
Application Number: JP,2022-007768
Category (FI): H10P52/00@C,B24B7/04@A,B24B5/04,H01L21/304,622@Q,H01L21/304,601@B,H01L21/304,631,H10P95/60@B,H10P52/00@T
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 21, 2022
Publication Date: Aug. 2, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....