Japan, Feb. 6 -- KANEKA CORP has got intellectual property rights for 'POLYIMIDE FILM WITH HIGH DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS TANGENT, MULTILAYER POLYIMIDE FILM, FLEXIBLE METAL-CLAD LAMINATE, AND FLEXIBLE PRINTED CIRCUIT BOARD.' Other related details are as follows:

Application Number: JP,2022-052843

Category (FI): H05K1/03,610@N,H05K1/03,670,H05K1/03,630@H,B32B27/28,C08K3/22,C08L79/08,B32B15/088,C08K3/013,B32B27/34,C08G73/10

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 29, 2022

Publication Date: Oct. 12, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....