Japan, Jan. 19 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND PRINTED WIRING BOARD USING THE SAME, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD.' Other related details are as follows:
Application Number: JP,2023-101632
Category (FI): C08G59/14,C08G59/17,G03F7/004,501,G03F7/004,512,G03F7/027,515,G03F7/20,501,G03F7/20,521,H05K3/28@D
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 21, 2023
Publication Date: Aug. 31, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....