Japan, Nov. 7 -- NITTO DENKO CORP has got intellectual property rights for 'OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR SEALING RESIN MOLDING, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2021-132268

Category (FI): H01L23/30@F,C08G59/42,H10H20/854,C08K5/1539,C08L63/00@C,H10H20/01@A,H01L33/56

Stage: Grant (IP right document published.)

Filing Date: Aug. 16, 2021

Publication Date: March 1, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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