Japan, Nov. 7 -- NITTO DENKO CORP has got intellectual property rights for 'OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR SEALING RESIN MOLDING, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2021-132268
Category (FI): H01L23/30@F,C08G59/42,H10H20/854,C08K5/1539,C08L63/00@C,H10H20/01@A,H01L33/56
Stage: Grant (IP right document published.)
Filing Date: Aug. 16, 2021
Publication Date: March 1, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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