Japan, Nov. 7 -- TDK CORP has got intellectual property rights for 'MULTILAYER ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2021-149381

Category (FI): H03H7/46@A,H03H7/075@A,H03H7/01@A

Stage: Grant (IP right document published.)

Filing Date: Sept. 14, 2021

Publication Date: March 27, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....