Japan, Feb. 6 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME.' Other related details are as follows:

Application Number: JP,2025-019359

Category (FI): H01G4/30,512,H01G4/30,201@K,H01G4/30,517,H01G4/30,311@Z,H01G4/12,270,C04B35/468

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Feb. 7, 2025

Publication Date: April 17, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....