Japan, Jan. 28 -- SAMSUNG SDI CO LTD has got intellectual property rights for 'MULTI-SLOT DIE, METHOD FOR COATING THE SAME, SLURRY SUPPLY SYSTEM, AND METHOD FOR SUPPLYING THE SLURRY.' Other related details are as follows:
Application Number: JP,2024-053648
Category (FI): B05C11/10,B05C5/02,B05D1/26@Z,B05D3/00@B,B05D3/00@D,B05D7/00@H,H01M4/04@A
Stage: Grant (IP right document published.)
Filing Date: March 28, 2024
Publication Date: March 6, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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