Japan, Feb. 6 -- TOWA CORP has got intellectual property rights for 'MOLDING DIE, RESIN-MOLDING DEVICE, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE.' Other related details are as follows:

Application Number: JP,2022-188768

Category (FI): H01L21/56@T,B29C45/26,H10W74/01@T,B29C45/14

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 25, 2022

Publication Date: June 6, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....