Japan, Feb. 12 -- SEIKO EPSON CORP has got intellectual property rights for 'MOLDED BODY MANUFACTURING APPARATUS AND MOLDED BODY MANUFACTURING METHOD.' Other related details are as follows:
Application Number: JP,2022-004204
Category (FI): B27N3/04@A,B27N3/04@D,B27N3/12
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 14, 2022
Publication Date: July 27, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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