Japan, Nov. 7 -- SEIKO EPSON CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING THREE-DIMENSIONAL MOLDED OBJECT AND THREE-DIMENSIONAL MOLDING APPARATUS.' Other related details are as follows:
Application Number: JP,2021-140983
Category (FI): B33Y10/00,B33Y30/00,B29C64/209,B29C64/35,B29C64/118,B22F12/53,B28B1/30
Stage: Grant (IP right document published.)
Filing Date: Aug. 31, 2021
Publication Date: March 13, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....