Japan, Oct. 30 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2021-134270
Category (FI): H05K3/18@E,H05K3/46@G
Stage: Grant (IP right document published.)
Filing Date: Aug. 19, 2021
Publication Date: March 3, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....