Japan, Jan. 20 -- NITTO DENKO CORP has got intellectual property rights for 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, WORK INTEGRATION DEVICE, AND FILM LAMINATE.' Other related details are as follows:
Application Number: JP,2021-137075
Category (FI): H01L21/56@R,H10W74/01@R
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 25, 2021
Publication Date: March 9, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....