Japan, Nov. 7 -- DENSO CORP,TOYOTA MOTOR CORP,MIRISE TECHNOLOGIES CORP has got intellectual property rights for 'MANUFACTURING EQUIPMENT OF SEMICONDUCTOR WAFERS.' Other related details are as follows:
Application Number: JP,2022-112726
Category (FI): H01L21/205,C23C16/52
Stage: Grant (IP right document published.)
Filing Date: July 13, 2022
Publication Date: Jan. 25, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....