Japan, Nov. 17 -- SHENMAO TECH INC has got intellectual property rights for 'LEAD-FREE SOLDER ALLOY AND SOLDER JOINT.' Other related details are as follows:
Application Number: JP,2023-121985
Category (FI): C22C13/00,C22C13/02,B23K35/26,310@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 26, 2023
Publication Date: June 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....