Japan, Jan. 28 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'LAMINATE TYPE ELECTRONIC COMPONENT AND MOUNTING SUBSTRATE THEREOF.' Other related details are as follows:

Application Number: JP,2021-144358

Category (FI): H01G2/06,500,H01G4/30,201@F,H01G4/30,201@G,H01G4/30,513,H01G4/30,516

Stage: Grant (IP right document published.)

Filing Date: Sept. 3, 2021

Publication Date: June 6, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....