Japan, Jan. 27 -- TOSHIBA CORP has got intellectual property rights for 'JOINING STRUCTURE OF SUPERCONDUCTIVE LAYER, SUPERCONDUCTIVE WIRE MATERIAL, SUPERCONDUCTIVE COIL, AND SUPERCONDUCTIVE APPARATUS.' Other related details are as follows:
Application Number: JP,2022-149262
Category (FI): H01F6/06,140,H01F6/06,500,H01B12/06,H01R4/68
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 20, 2022
Publication Date: April 2, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....