Japan Intellectual Property Rights: ETCHING METHOD AND PLASMA PROCESSING APPARATUS

Japan, Jan. 28 -- TOKYO ELECTRON LTD has got intellectual property rights for 'ETCHING METHOD AND PLASMA PROCESSING APPARATUS.' Other related details are as follows:

Application Number: JP,2022-210014

Category (FI): H01L21/302,101@B,H01L21/302,101@C,H01L21/302,101@D,H01L21/302,105@A,H10P50/20,101@B,H10P50/20,101@C,H10P50/20,101@D,H10P50/20,105@A,H10P50/24,H10P50/26,H10P50/28

Stage: Grant (IP right document published.)

Filing Date: Dec. 27, 2022

Publication Date: July 9, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....