Japan, Oct. 30 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:
Application Number: JP,2021-129064
Category (FI): H01L23/30@R,C08G59/04,C08L63/00,C08K3/22,C08K3/013,C08L63/00@C
Stage: Grant (IP right document published.)
Filing Date: Aug. 5, 2021
Publication Date: Feb. 16, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....