Japan, Nov. 7 -- TAIYO YUDEN CO LTD has got intellectual property rights for 'ELECTRONIC COMPONENT, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT.' Other related details are as follows:
Application Number: JP,2024-073426
Category (FI): H01C7/18,H01G4/30,311@Z,H01G4/30,201@A,H01G4/30,517,H01G4/30,511
Stage: Grant (IP right document published.)
Filing Date: April 30, 2024
Publication Date: July 25, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....