Japan, Oct. 30 -- FASFORD TECHNOLOGY CO LTD has got intellectual property rights for 'DIE BONDING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2021-149988
Category (FI): H01L21/52@F,H01L21/52@C
Stage: Grant (IP right document published.)
Filing Date: Sept. 15, 2021
Publication Date: March 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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