Japan, Jan. 21 -- DIC CORP has got intellectual property rights for 'CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER.' Other related details are as follows:
Application Number: JP,2021-167287
Category (FI): C08F290/14,C08F20/20,H05K3/28@C
Stage: Grant (IP right document published.)
Filing Date: Oct. 12, 2021
Publication Date: April 24, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....