Japan, Feb. 12 -- SEIKO EPSON CORP has got intellectual property rights for 'COMPACT MANUFACTURING METHOD AND BINDER.' Other related details are as follows:
Application Number: JP,2021-192659
Category (FI): B27N3/04@D,D04H1/425,D04H1/587,D04H1/732
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 29, 2021
Publication Date: June 8, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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