Japan, Feb. 12 -- SEIKO EPSON CORP has got intellectual property rights for 'COMPACT MANUFACTURING METHOD AND BINDER.' Other related details are as follows:
Application Number: JP,2021-195913
Category (FI): D04H1/4274,D04H1/425,D04H1/732,B27N3/04@D,D04H1/587
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 2, 2021
Publication Date: June 14, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....