Japan, Feb. 6 -- TOKYO ELECTRON LTD has got intellectual property rights for 'BONDING DEVICE, BONDING SYSTEM, BONDING METHOD, PROGRAM AND COMPUTER STORAGE MEDIA.' Other related details are as follows:
Application Number: JP,2024-174136
Category (FI): H01L21/68@N,H01L21/02@B,H10P72/70
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 3, 2024
Publication Date: Dec. 19, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....