Japan, Jan. 27 -- KIOXIA CORP has got intellectual property rights for 'BONDING APPARATUS, BONDING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-096807
Category (FI): H01L21/68@N,H10P72/70,H10D30/69,H10D30/01,501,H10B43/27,H01L29/78,371,H01L27/11582,H01L21/02@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 15, 2022
Publication Date: Dec. 27, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....