MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202311079714 A) filed by Chandigarh Group Of Colleges, Mohali, Punjab, on Nov. 23, 2023, for 'wood stack bundling device.'
Inventor(s) include Rajni Verma; Anmol Gautam; and Ashwini K. Sharma.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a wood stack bundling device, comprising a cuboidal body 1 configured with multiple motorized Omni-directional wheels 2 developed to positioned on a ground surface, an inlet 3 crafted with slidable tray 4 mapped on the body 1 for allowing a user to position multiple wooden logs ...