MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517038645 A) filed by Boe Technology Group Co. Ltd.; Boe Mled Technology Co. Ltd.; and Beijing Boe Technology Development Co. Ltd., Beijing, on April 22, for 'wiring substrate and method of manufacturing the same, backplane, and display device.'
Inventor(s) include Zhai, Ming; Liu, Chao; Wang, Lili; Feng, Shanshan; Zhao, Jingping; Wang, Jing; Liu, Mengqing; Wang, Huaimin; Jia, Mingming; Shi, Lingyun; and Qi, Qi.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "A wiring substrate (100). The wiring substrate (100) comprises: a base (10), and a p...