MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517081154 A) filed by Avient Corporation, Avon Lake, U.S.A., on Aug. 27, for 'wafer carrier with moisture scavenging.'
Inventor(s) include Purayath, Vinod; Messmore, Benjamin; Scaglione, Heather; Silva, Italo; Suter, Ii, John D.; and Ohama, Kenta.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "A wafer carrier includes a housing having an interior space and a moisture scavenging compound in fluid communication with the interior space. The carrier provides a microenvironment with moisture control for semiconductor wafers enclosed within the ...